Power chips are attached to outside circuits with packaging, and their efficiency depends on the assistance of the product packaging. In high-power situations, power chips are generally packaged as power components. Chip affiliation describes the electric link on the upper surface of the chip, which is usually aluminum bonding wire in typical modules. ^
Typical power component bundle cross-section
At present, industrial silicon carbide power components still mostly utilize the product packaging innovation of this wire-bonded typical silicon IGBT module. They deal with troubles such as huge high-frequency parasitical parameters, inadequate warmth dissipation capability, low-temperature resistance, and inadequate insulation stamina, which restrict the use of silicon carbide semiconductors. The screen of exceptional efficiency. In order to address these troubles and fully make use of the significant possible benefits of silicon carbide chips, numerous brand-new product packaging modern technologies and options for silicon carbide power components have actually arised in recent years.
Silicon carbide power component bonding approach
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding products have actually developed from gold cord bonding in 2001 to light weight aluminum cord (tape) bonding in 2006, copper wire bonding in 2011, and Cu Clip bonding in 2016. Low-power gadgets have established from gold cords to copper cables, and the driving force is cost reduction; high-power tools have actually created from light weight aluminum cords (strips) to Cu Clips, and the driving pressure is to improve product performance. The greater the power, the greater the requirements.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging procedure that makes use of a solid copper bridge soldered to solder to link chips and pins. Compared to typical bonding product packaging methods, Cu Clip technology has the complying with benefits:
1. The link between the chip and the pins is made from copper sheets, which, to a specific level, replaces the conventional cable bonding method between the chip and the pins. Consequently, an one-of-a-kind plan resistance worth, greater present circulation, and far better thermal conductivity can be acquired.
2. The lead pin welding location does not require to be silver-plated, which can totally conserve the cost of silver plating and bad silver plating.
3. The item look is totally consistent with typical items and is mainly made use of in web servers, portable computers, batteries/drives, graphics cards, electric motors, power supplies, and various other fields.
Cu Clip has two bonding approaches.
All copper sheet bonding method
Both eviction pad and the Resource pad are clip-based. This bonding method is extra expensive and complex, but it can accomplish far better Rdson and far better thermal results.
( copper strip)
Copper sheet plus wire bonding approach
The resource pad uses a Clip approach, and the Gate makes use of a Wire technique. This bonding technique is a little more affordable than the all-copper bonding method, conserving wafer area (applicable to really small gateway areas). The process is less complex than the all-copper bonding technique and can get far better Rdson and far better thermal effect.
Distributor of Copper Strip
TRUNNANOÂ is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding raw copper, please feel free to contact us and send an inquiry.
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